| US 7,557,383 B2 | ||
| Lighting apparatus | ||
| Kunihiko Obara, Kagoshima (Japan); Koji Nakatsu, Kagoshima (Japan); Hiromi Kitahara, Kagoshima (Japan); Toshihide Maeda, Kagoshima (Japan); and Hideo Nagai, Osaka (Japan) | ||
| Assigned to Panasonic Corporation, Osaka (Japan) | ||
| Appl. No. 10/571,856 PCT Filed Sep. 21, 2004, PCT No. PCT/JP2004/014124 § 371(c)(1), (2), (4) Date Mar. 13, 2006, PCT Pub. No. WO2005/029597, PCT Pub. Date Mar. 31, 2005. |
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| Claims priority of application No. 2003-327807 (JP), filed on Sep. 19, 2003. | ||
| Prior Publication US 2007/0097684 A1, May 03, 2007 | ||
| Int. Cl. H01L 33/00 (2006.01) | ||
| U.S. Cl. 257—98 [257/99; 257/100] | 16 Claims |
| 1. A lighting apparatus comprising:
a substrate;
a semiconductor light emitting device mounted on the substrate;
a resin layer formed on a mounting surface of the substrate, said resin layer having a bottom portion having a flat surface,
a base portion extending from the bottom portion and having a side surface substantially perpendicular to said flat surface,
and a lens portion extending from the base portion, said resin layer being configured to seal the semiconductor light emitting
device; and
a reflecting plate having a through-hole from an array of through-holes, the through-hole being configured to enable the lens
portion to extend therethrough, the though-hole defining a reflecting surface;
wherein the reflecting plate and the lens portion are positioned with a space therebetween such that the reflecting surface
is not in contact with base portion and;
wherein the reflecting plate is on and in contact with the flat surface;
wherein the reflecting plate is attached to at least one of the resin layer and the substrate by a fastening member; and
wherein the reflecting plate is a molded piece made of a material selected from the group consisting of metal, ceramic and
a mixture thereof, and a plating layer is supplied to a surface of the molded piece.
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