| US 7,557,016 B2 | ||
| Dicing method using an encased dicing blade submerged in cooling water | ||
| Kiyoaki Kadoi, Chiba (Japan) | ||
| Assigned to Seiko Instruments Inc., (Japan) | ||
| Filed on Jan. 30, 2007, as Appl. No. 11/699,794. | ||
| Claims priority of application No. 2006-022739 (JP), filed on Jan. 31, 2006. | ||
| Prior Publication US 2007/0175466 A1, Aug. 02, 2007 | ||
| Int. Cl. B28D 1/04 (2006.01); H01L 21/301 (2006.01); H01L 21/78 (2006.01) | ||
| U.S. Cl. 438—460 [125/13.01] | 18 Claims |
| 1. A dicing method of cutting a semiconductor wafer by a dicing blade which rotates at high speed, the dicing method comprising:
surrounding all but a lower peripheral portion of the dicing blade by a case;
filling an inside of the case with a cooling water so that the entire dicing blade except for the lower peripheral portion
thereof is submerged in the cooling water; and
cutting the wafer with the dicing blade while cooling the dicing blade and a cutting point with the cooling water.
|