| US 7,555,948 B2 | ||
| Process condition measuring device with shielding | ||
| Lynn Karl Wiese, 3534 Butcher Dr., Santa Clara, Calif. 95051 (US); and Earl M. Jensen, 398 Peachtree La., San Jose, Calif. 95128 (US) | ||
| Filed on May 05, 2006, as Appl. No. 11/381,992. | ||
| Application 11/381992 is a continuation in part of application No. 11/380985, filed on May 01, 2006. | ||
| Prior Publication US 2007/0251339 A1, Nov. 01, 2007 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. G01D 11/24 (2006.01) | ||
| U.S. Cl. 73—431 | 9 Claims |
| 1. A method of forming a process condition measuring device having protection against electromagnetic fields, comprising:
forming a first substrate portion of a conductive material;
forming a first contact pad on the first substrate portion, the first contact pad in direct electrical contact with the first
substrate portion;
forming a second substrate portion of the conductive material;
forming a second contact pad on the second substrate portion, the second contact pad in direct electrical contact with the
second substrate portion;
placing an electronic circuit between the first substrate portion and the second substrate portion; and subsequently, connecting the first substrate portion and the second substrate portion together, with the electronic circuit
between them, such that the first contact pad is electrically connected to the second padwherein the conductive material is doped Silicon.
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