| US 7,394,665 B2 | ||
| LSI package provided with interface module and method of mounting the same | ||
| Hiroshi Hamasaki, Hiratsuka (Japan); and Hideto Furuyama, Yokohama (Japan) | ||
| Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan) | ||
| Filed on Feb. 17, 2004, as Appl. No. 10/778,030. | ||
| Claims priority of application No. 2003-039828 (JP), filed on Feb. 18, 2003. | ||
| Prior Publication US 2004/0218372 A1, Nov. 04, 2004 | ||
| Int. Cl. H05K 1/11 (2006.01); H05K 1/14 (2006.01) | ||
| U.S. Cl. 361—803 [361/706; 361/767; 361/764; 361/784] | 19 Claims |
| 1. An LSI package arranged on a mounting board and configured to be provided with a heat dissipation member, comprising:
an LSI configured to process signals, the LSI having signal input and output terminals and a surface to be coupled to the
heat dissipation member;
an interposer configured to mount the LSI, and including first signal terminals electrically connected to the signal input
and output terminals of the LSI, second electric terminals for electrically connecting the LSI to the mounting board, internal
wirings electrically connected to the first signal terminals, and first coupling parts electrically connected to the internal
wirings; and
an interface module including signal transmission lines configured to transmit the signals to outside and to receive the signals
from outside, second coupling parts electrically connected to the signal transmission lines, and a package structure configured
to hold the signal transmission lines and the second coupling parts, the second coupling parts being electrically connected
to the first coupling parts by means of mechanical contact, respectively, and the package structure being mounted on the interposer
and having a through-opening to receive the LSI to allow the heat dissipation member to be located above the surface of the
LSI.
|