| US 7,394,163 B2 | ||
| Method of mounting semiconductor chip | ||
| Shunji Baba, Kawasaki (Japan); Takatoyo Yamakami, Kawasaki (Japan); Norio Kainuma, Kawasaki (Japan); Kenji Kobae, Kawasaki (Japan); Hidehiko Kira, Kawasaki (Japan); and Hiroshi Kobayashi, Kawasaki (Japan) | ||
| Assigned to Fujitsu Limited, Kawasaki (Japan) | ||
| Filed on Jul. 03, 2002, as Appl. No. 10/187,843. | ||
| Application 10/187843 is a division of application No. 09/614726, filed on Jul. 12, 2000, granted, now 6,437,450. | ||
| Claims priority of application No. 2000-124878 (JP), filed on Apr. 25, 2000. | ||
| Prior Publication US 2002/0164837 A1, Nov. 07, 2002 | ||
| Int. Cl. H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01) | ||
| U.S. Cl. 257—783 [257/778; 257/782; 257/785; 438/118; 438/119; 228/1.1; 228/2.1] | 2 Claims |
| 1. A semiconductor chip mounting device, comprising:
a bonding tool that presses a semiconductor chip while an insulating adhesive is interposed between the semiconductor chip
provided with bumps and a substrate provided with pads, and ultrasonically bonds the bumps to the pads,
wherein the bonding tool has a square pole shape and has side surfaces that are bent inward with respect to virtual flat surfaces
between adjacent corners of the bonding tool.
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