US 7,394,120 B2
Semiconductor device having a shaped gate electrode and method of manufacturing the same
Hiroyuki Yamasaki, Kanagawa (Japan); and Hitoshi Ito, Kanagawa (Japan)
Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan)
Filed on Jun. 07, 2005, as Appl. No. 11/146,029.
Claims priority of application No. 2005-021570 (JP), filed on Jan. 28, 2005.
Prior Publication US 2006/0170006 A1, Aug. 03, 2006
Int. Cl. H01L 29/78 (2006.01)
U.S. Cl. 257—288  [257/E21.206; 257/E29.136; 257/410] 12 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
an MIS transistor including a gate electrode located to intersect a device region of a semiconductor substrate isolated by a device isolation region; source and drain regions provided in the semiconductor substrate at both sides of the gate electrode; and elevated source and drain located above the source and drain regions, the elevated source and drain having a facet along an edge of the device isolation region, and the gate electrode having a first portion located in a device region and a second portion located at a boundary between the device isolation region and the device region,
a gate length of the second portion being about (D1+E1 )/D1 of the gate length of the first portion, D1 being a junction depth of the source and drain where the facet is not formed, and E1 being a length from an upper face of the elevated source and drain to a surface of the semiconductor substrate where the facet is not formed.