| US 7,394,027 B2 | ||
| Multi-layer printed circuit board comprising a through connection for high frequency applications | ||
| Heiko Kaluzni, Grossenhain (Germany); and Andreas Huschka, Dresden (Germany) | ||
| Assigned to Advanced Micro Devices, Inc., Austin, Tex. (US) | ||
| Filed on Jul. 13, 2005, as Appl. No. 11/180,756. | ||
| Claims priority of application No. 10 2004 060 962 (DE), filed on Dec. 17, 2004. | ||
| Prior Publication US 2006/0131611 A1, Jun. 22, 2006 | ||
| Int. Cl. H01R 12/04 (2006.01); H05K 1/00 (2006.01) | ||
| U.S. Cl. 174—262 [361/794; 29/830] | 16 Claims |
| 1. A high frequency multi-layer printed circuit board, comprising:
a layer stack comprising a first metal-comprising layer, a second metal-comprising layer,
a first outer metal-comprising layer, a second outer metal-comprising layer, and a plurality of dielectric layers including
at least a first dielectric layer separating said first and second metal-comprising layers, at least a second dielectric layer
separating said first metal-comprising layer and said first outer metal-comprising layer, and at least a third dielectric
layer separating said second metal-comprising layer and said second outer metal-comprising layer; and
a transition structure comprising:
a through connection extending from said first metal-comprising layer through said first dielectric layer to said second metal-comprising
layer;
an impedance adapting structure surrounding said through connection at least partially and providing a characteristic impedance
of said transition structure, said characteristic impedance being adapted to a desired impedance value; and
an outer via connecting said through connection to a structure disposed on said first outer metal-comprising layer.
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