| US 7,393,716 B2 | ||
| Encapsulated organic semiconductor device and method | ||
| Steven Scheifers, Hoffman Estates, Ill. (US); Daniel Gamota, Palatine, Ill. (US); Andrew Skipor, West Chicago, Ill. (US); and Krishna Kalyanasundaram, Chicago, Ill. (US) | ||
| Assigned to Motorola, Inc., Schaumburg, Ill. (US) | ||
| Filed on Apr. 15, 2005, as Appl. No. 11/108,025. | ||
| Application 11/108025 is a division of application No. 10/114488, filed on Apr. 02, 2002, abandoned. | ||
| Prior Publication US 2005/0189537 A1, Sep. 01, 2005 | ||
| Int. Cl. H01L 51/00 (2006.01); H01L 21/00 (2006.01); H01L 29/08 (2006.01); H01L 35/24 (2006.01) | ||
| U.S. Cl. 438—99 [438/115; 257/40; 257/E23.002; 257/E21.502] | 19 Claims |
| 1. A method comprising:
providing at least one organic semiconductor device having at least some organic semiconductor material wherein the organic
semiconductor device exhibits significant electrical performance degradation when the organic semiconductor material is exposed
to at least a first given condition;
disposing a barrier between the organic semiconductor material and local environment to protect the organic semiconductor
material from the given condition in the local environment, wherein disposing a barrier further comprises disposing a barrier
between the organic semiconductor material and the local environment such that the organic semiconductor device is substantially
protected for only a temporary predetermined maximum period of time from electrical performance degradation due to the first
given condition in the local environment.
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