| US 7,393,706 B2 | ||
| Method of manufacturing optical semiconductor device, package molding jig, method of manufacturing package molding jig and manufacturing apparatus for package molding jig | ||
| Masaki Adachi, Yokohama (Japan); Masaharu Yamanaka, Yokohama (Japan); Fumihide Nagashima, Yokohama (Japan); Tatsuhiko Nagafuchi, Kitakyushu (Japan); Takao Abe, Yukuhashi (Japan); Masayoshi Harada, Buzen (Japan); Hirofumi Hansei, Buzen (Japan); and Hironari Kotsubo, Buzen (Japan) | ||
| Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan) | ||
| Filed on Mar. 07, 2005, as Appl. No. 11/72,233. | ||
| Claims priority of application No. 2004-078316 (JP), filed on Mar. 18, 2004. | ||
| Prior Publication US 2005/0208690 A1, Sep. 22, 2005 | ||
| Int. Cl. H01L 21/00 (2006.01) | ||
| U.S. Cl. 438—26 | 19 Claims |
| 1. A method of manufacturing an optical semiconductor device, comprising:
preparing an optical semiconductor provided on a distal end of a first lead portion of a lead frame and connected electrically
with a distal end of a second lead portion of the lead frame;
forming a package molding jig having concave portions each corresponding to a contour of a package of the optical semiconductor
device by deep-draw forming a thermoplastic resin sheet using a punch with a shape corresponding to the contour of the package;
inserting the distal ends of the lead portions into the concave portion of the package molding jig for positioning and fixing;
and
filling packaging resin in the concave portion of the package molding jig.
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