| US 7,393,580 B2 | ||
| Layered board and electronic apparatus having the layered board | ||
| Takashi Kanda, Kawasaki (Japan) | ||
| Assigned to Fujitsu Limited, Kawasaki (Japan) | ||
| Filed on Oct. 27, 2005, as Appl. No. 11/258,856. | ||
| Claims priority of application No. 2005-198218 (JP), filed on Jul. 07, 2005. | ||
| Prior Publication US 2007/0009718 A1, Jan. 11, 2007 | ||
| Int. Cl. B32B 3/00 (2006.01); H05K 1/14 (2006.01) | ||
| U.S. Cl. 428—209 [428/192; 174/250; 174/255; 361/736; 361/742] | 11 Claims |
| 1. A layered board comprising:
a core layer which serves as a printed board;
a buildup layer which includes an insulation part and a wiring part, is overlaid on said core layer, and is electrically connected
to said core layer; and
an edge layer formed at least at an edge on a periphery of said core layer, said edge layer being made of a material different
from that of said core layer,
wherein said edge layer is formed at the edge on the periphery of said core layer and at an edge on the periphery of said
buildup layer.
|