| US 7,554,204 B2 | ||
| Die offset die to die bonding | ||
| Nguk Chin Lai, Penang (Malaysia); Kevin Guan, Richmond, Calif. (US); Kwet Nam Wong, Penang (Malaysia); Cheng Sim Kee, Penang (Malaysia); and Sally Foong, Milpitas, Calif. (US) | ||
| Assigned to Spansion LLC, Sunnyvale, Calif. (US) | ||
| Filed on Jun. 18, 2007, as Appl. No. 11/820,278. | ||
| Prior Publication US 2008/0308947 A1, Dec. 18, 2008 | ||
| Int. Cl. H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01) | ||
| U.S. Cl. 257—777 [257/E23.003] | 8 Claims |
| 1. An electronic device comprising;
a body;
a semiconductor die on and supported by the body and having first and second opposite edges which extend beyond respective
first and second opposite edges of the body to define a first unsupported portion of the die running from the first edge of
the body to the first edge of the die and a second unsupported portion of the die running from the second edge of the body
to the second edge of the die;
the first edge of the die extending beyond the first edge of the body to a lesser extent than the second edge of the die extends
beyond the second edge of the body.
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