| US 7,554,136 B2 | ||
| Micro-switch device and method for manufacturing the same | ||
| Fumikazu Takayanagi, Tokyo (Japan); Yoshiaki Moro, Tokyo (Japan); and Hirokazu Sanpei, Tokyo (Japan) | ||
| Assigned to Advantest Corporation, Tokyo (Japan) | ||
| Filed on Mar. 11, 2005, as Appl. No. 11/78,687. | ||
| Application 11/078687 is a continuation of application No. PCT/JP03/11404, filed on Sep. 08, 2003. | ||
| Claims priority of application No. 2002-268814 (JP), filed on Sep. 13, 2002. | ||
| Prior Publication US 2005/0218530 A1, Oct. 06, 2005 | ||
| Int. Cl. G01C 19/56 (2006.01) | ||
| U.S. Cl. 257—254 [257/415; 257/417; 257/420; 257/686; 257/704; 257/734; 257/690; 257/692; 257/693; 257/694; 257/695; 257/696; 257/697] | 9 Claims |
| 1. A micro device that is manufactured by semiconductor process and is electrically connected to outside for its operation,
comprising:
a circuit board;
an electrode pad being provided on said circuit board;
a lead substrate being provided substantially parallel to said circuit board;
a lead of conductive member being electrically connected to said electrode pad by being bent in a direction away from a surface
of said lead substrate, a portion of said lead being adhered to said lead substrate and one end being a free end; and
a cap substrate provided over an upper surface of said lead substrate and, together with the lead substrate, defining a through-hole
in which the free end of said lead moves.
|