US 7,553,803 B2
	Enhancement of silicon-containing particulate material removal using supercritical fluid-based compositions
Michael B. Korzenski, Danbury, Conn. (US); and Thomas H. Baum, New Fairfield, Conn. (US)
Assigned to Advanced Technology Materials, Inc., Danbury, Conn. (US)
Filed on Mar. 01, 2004, as Appl. No. 10/790,535.
Prior Publication US 2005/0192193 A1, Sep. 01, 2005
Int. Cl. C11D 7/50 (2006.01); C11D 7/60 (2006.01); C11D 3/43 (2006.01); C11D 3/60 (2006.01); C23G 5/02 (2006.01); B08B 7/00 (2006.01)

U.S. Cl. 510—175  [510/176; 510/421; 510/426; 510/432; 134/2; 134/3; 134/25.4; 134/41; 134/42]

56 Claims

1. A supercritical fluid (SCF) based composition comprising at least one co-solvent, at least one etchant species, at least one surface passivator, a binder interactive with silicon-containing particulate material to enhance removal thereof, water, and optionally at least one surfactant, wherein said binder is derived from at least one ethylenically unsaturated reactant, wherein said etchant species is selected from the group consisting of hydrofluoric acid, ammonium fluoride, triethylamine trihydrofluoride, ammonium bifluoride, tetraalkylammonium bifluorides having the formula (R)4NHF2 and alkyl phosphonium bifluorides having the formula (R)4PHF2, wherein R is selected from the group consisting of methyl, ethyl, butyl, phenyl and fluorinated C1-C4 alkyl groups, wherein said composition is useful for removing silicon-containing particulate material from the surface of a semiconductor wafer, and wherein the surface passivator is selected from the group consisting of boric acid and triethyl borate.