(i) sequentially growing a first conductivity type nitride layer, an active layer and a second conductivity type nitride layer on a preliminary growth substrate to form a light emission structure;

(ii) cutting a predetermined area of the light emission structure according to a final size of light emitting devices to be produced in such a way that a predetermined thickness of the first conductivity type nitride layer in the predetermined area remains intact from the cutting;

(iii) providing a permanent conductive substrate having electric conductivity on an upper surface of the light emission structure;

(iv) dicing the preliminary substrate into a plurality of units;

(v) irradiating laser beam on a lower surface of the preliminary substrate to separate the preliminary substrate from the light emission structure, whereby the remaining thickness part of the first conductivity type nitride layer is removed, thereby separating the light emission structure according to the light emitting devices;

(vi) forming first contacts on surfaces of the first conductivity type nitride layer separated after the preliminary substrate is removed and forming a second contact on the permanent conductive substrate; and

(vii) dicing the permanent conductive substrate into the light emitting devices.