| US 7,553,400 B2 | ||
| Plating apparatus and plating method | ||
| Mizuki Nagai, Tokyo (Japan); Hiroyuki Kanda, Tokyo (Japan); Keiichi Kurashina, Tokyo (Japan); Satoru Yamamoto, Tokyo (Japan); Ryoichi Kimizuka, Kanagawa-ken (Japan); Hariklia Deligianni, Yorktown Heights, N.Y. (US); Brett Baker, Yorktown Heights, N.Y. (US); Keith Kwietniak, Yorktown Heights, N.Y. (US); Panayotis Andricacos, Yorktown Heights, N.Y. (US); and Phillipe Vereecken, Yorktown Heights, N.Y. (US) | ||
| Assigned to Ebara Corporation, Tokyo (Japan); and International Business Machines Corporation (IBM), Armonk, N.Y. (US) | ||
| Filed on Dec. 21, 2004, as Appl. No. 11/16,924. | ||
| Claims priority of application No. 2003-431211 (JP), filed on Dec. 25, 2003. | ||
| Prior Publication US 2005/0241946 A1, Nov. 03, 2005 | ||
| Int. Cl. C25D 5/22 (2006.01) | ||
| U.S. Cl. 205—93 [205/137] | 16 Claims |
| 1. A plating method comprising:
(a) disposing a substrate having fine interconnect recesses such that a conductive layer formed on a surface of the substrate
faces an anode;
(b) disposing a porous member between the substrate and the anode;
(c) filling a plating solution containing metal ions, a supporting electrolyte, halogen ions, and at least one of an organic
sulfur compound, a high polymer compound, and an organic nitrogen compound between the substrate and the anode;
(d) holding the conductive layer and the porous member in contact with each other and moving the porous member and the substrate,
which has the conductive layer formed thereon, relative to each other for a predetermined time without passing an electric
current between the conductive layer and the anode so that the conductive layer is in intimate contact with the porous member
for a predetermined time, and stopping the movement of the substrate with respect to the porous member;
(e) passing an electric current between the conductive layer and the anode for predetermined time, and stopping said passing
of the electric current between the conductive layer and the anode after said stopping the movement of the substrate with
respect to the porous member;
(f) releasing the porous member from the surface of the substrate, thereby embedding metal in the fine interconnect recesses
after said stopping said passing of the electric current between the conductive layer and the anode; and
(g) repeating (d) through (f).
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