CPC H05K 1/028 (2013.01) [H05K 1/0283 (2013.01); H05K 1/032 (2013.01); H05K 1/189 (2013.01); H05K 3/0014 (2013.01); H05K 3/284 (2013.01)] | 19 Claims |
1. An electronic device, comprising:
a flexible substrate; and
a plurality of functional components integrated on the flexible substrate;
wherein the flexible substrate is folded into a three-dimensional structure in accordance with an origami or a kirigami pattern,
wherein the flexible substrate comprises a plurality of rigid regions and a plurality of flexible interconnects, and the plurality of flexible interconnects connect the plurality of rigid regions,
wherein at least one portion of the flexible substrate is removed, and the at least one portion removed from the flexible substrate is removed adjacent to a vertex of a rigid region of the origami or kirigami pattern to cause separation of multiple flexible interconnects among the plurality of flexible interconnects at the vertex of the rigid region of the origami or kirigami pattern, and
wherein the functional components are electrically connected and the functional components are mounted on the rigid regions.
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