US 11,682,828 B2
Integrated millimeter wave antenna modules
Jennifer M. Edwards, San Francisco, CA (US); Siwen Yong, San Francisco, CA (US); Jiangfeng Wu, San Jose, CA (US); Harish Rajagopalan, San Jose, CA (US); Bilgehan Avser, Pacifica, CA (US); Simone Paulotto, Redwood City, CA (US); and Mattia Pascolini, San Francisco, CA (US)
Assigned to Apple Inc., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Apr. 25, 2022, as Appl. No. 17/728,817.
Application 17/728,817 is a continuation of application No. 16/990,879, filed on Aug. 11, 2020, granted, now 11,335,992.
Claims priority of provisional application 62/896,140, filed on Sep. 5, 2019.
Prior Publication US 2022/0255212 A1, Aug. 11, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01Q 1/22 (2006.01); H01Q 5/335 (2015.01); H01Q 5/392 (2015.01); H01Q 1/24 (2006.01); H01Q 23/00 (2006.01)
CPC H01Q 1/2283 (2013.01) [H01Q 1/243 (2013.01); H01Q 5/335 (2015.01); H01Q 5/392 (2015.01); H01Q 23/00 (2013.01)] 19 Claims
OG exemplary drawing
 
1. Apparatus comprising:
a first substrate;
a second substrate surface-mounted to the first substrate;
antennas on the second substrate and configured to radiate at a frequency greater than 10 GHz; and
a radio-frequency integrated circuit surface-mounted to the first substrate and communicably coupled to the antennas through the first substrate.