US 11,682,656 B2
Semiconductor device package and method for manufacturing the same
You-Lung Yen, Taoyuan (TW); Bernd Karl Appelt, Holly Springs, NC (US); and Kay Stefan Essig, Radebeul (DE)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Oct. 12, 2021, as Appl. No. 17/499,646.
Application 17/499,646 is a continuation of application No. 16/523,787, filed on Jul. 26, 2019, granted, now 11,145,624.
Prior Publication US 2022/0037290 A1, Feb. 3, 2022
Int. Cl. H01L 25/065 (2023.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 21/56 (2006.01)
CPC H01L 25/0657 (2013.01) [H01L 21/568 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 25/50 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A semiconductor device package, comprising:
a substrate comprising a circuit layer, the substrate including a first surface and a second surface opposite to the first surface, at least one recess recessed from the second surface and partially exposing the circuit layer, and a bottom surface of the circuit layer in the recess is recessed from the second surface of the substrate;
a first electronic component disposed above the first surface;
a second electronic component stacked adjacent to the first electronic component;
an encapsulation layer at least encapsulating the second electronic component and partially covering the second surface of the substrate; and
an electrical conductor extending from the second surface of the substrate into the recess of the substrate, and contacting the bottom surface of the circuit layer,
wherein a space is defined between the encapsulation layer and the electrical conductor.