CPC H01L 23/481 (2013.01) [H01L 23/53228 (2013.01); H01L 29/42372 (2013.01)] | 12 Claims |
1. An electronic device, comprising:
a flexible substrate comprising a through hole;
a connecting element disposed in the through hole;
a semiconductor disposed on the flexible substrate; and
a first conductive element disposed under the flexible substrate, wherein the first conductive element electrically connects to the semiconductor through the connecting element,
wherein, in a direction perpendicular to a normal direction of the flexible substrate, a distance between the semiconductor and the connecting element ranges from 5 μm to 500 μm.
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