CPC H01L 23/373 (2013.01) [B23K 1/0008 (2013.01); H01L 21/4882 (2013.01); H01L 22/12 (2013.01); H01L 23/367 (2013.01); H01L 25/0655 (2013.01); H01L 23/3675 (2013.01); H01L 23/3737 (2013.01)] | 20 Claims |
1. An electronic system, comprising:
a plurality of heat sources,
wherein at least two of the plurality of heat sources vary in height, and
wherein each of the plurality of heat sources includes a first side and a second side;
a substrate having a first side and a second side,
wherein the second side of each of the plurality of heat sources is positioned adjacent to the first side of the substrate;
a cover member provided above the plurality of heat sources;
a sintering thermal interface material provided between the cover member and the first side of one of the at least two heat sources that vary in height; and
a solder thermal interface material provided between the cover member and the first side of another of the at least two heat sources that vary in height.
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