US 11,682,603 B2
Control of thermal interface material in multi-chip package
Cheng Yang, Shanghai (CN); and Dongkai Shangguan, San Jose, CA (US)
Assigned to Flex Ltd., Singapore (SG)
Filed by Flex Ltd., Singapore (SG)
Filed on Mar. 25, 2021, as Appl. No. 17/212,525.
Claims priority of application No. 202010235427.5 (CN), filed on Mar. 27, 2020.
Prior Publication US 2021/0305124 A1, Sep. 30, 2021
Int. Cl. H01L 23/373 (2006.01); H01L 23/367 (2006.01); H01L 21/66 (2006.01); H01L 21/48 (2006.01); B23K 1/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/373 (2013.01) [B23K 1/0008 (2013.01); H01L 21/4882 (2013.01); H01L 22/12 (2013.01); H01L 23/367 (2013.01); H01L 25/0655 (2013.01); H01L 23/3675 (2013.01); H01L 23/3737 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic system, comprising:
a plurality of heat sources,
wherein at least two of the plurality of heat sources vary in height, and
wherein each of the plurality of heat sources includes a first side and a second side;
a substrate having a first side and a second side,
wherein the second side of each of the plurality of heat sources is positioned adjacent to the first side of the substrate;
a cover member provided above the plurality of heat sources;
a sintering thermal interface material provided between the cover member and the first side of one of the at least two heat sources that vary in height; and
a solder thermal interface material provided between the cover member and the first side of another of the at least two heat sources that vary in height.