CPC H01L 23/3675 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/4871 (2013.01); H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/49822 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 2224/16227 (2013.01)] | 20 Claims |
1. A semiconductor device comprising:
a first semiconductor die connected to an interposer;
an encapsulant encapsulating the first semiconductor die; and
a first lid in direct physical contact with both the first semiconductor die and the encapsulant, the first lid crossing an interface between the first semiconductor die and the encapsulant.
|