US 11,682,602 B2
Semiconductor device and method of manufacture
Shu-Shen Yeh, Taoyuan (TW); Chin-Hua Wang, New Taipei (TW); Chia-Kuei Hsu, Hsinchu (TW); Po-Yao Lin, Zhudong Township (TW); and Shin-Puu Jeng, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Apr. 30, 2021, as Appl. No. 17/246,035.
Claims priority of provisional application 63/145,631, filed on Feb. 4, 2021.
Prior Publication US 2022/0246490 A1, Aug. 4, 2022
Int. Cl. H01L 23/367 (2006.01); H01L 25/065 (2023.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 25/00 (2006.01)
CPC H01L 23/3675 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/4871 (2013.01); H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/49822 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 2224/16227 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a first semiconductor die connected to an interposer;
an encapsulant encapsulating the first semiconductor die; and
a first lid in direct physical contact with both the first semiconductor die and the encapsulant, the first lid crossing an interface between the first semiconductor die and the encapsulant.