CPC G02F 1/157 (2013.01) [B29D 11/00009 (2013.01); B32B 27/08 (2013.01); B32B 27/365 (2013.01); B29K 2069/00 (2013.01); B32B 2250/05 (2013.01); B32B 2307/20 (2013.01); B32B 2551/00 (2013.01)] | 17 Claims |
1. A laminated structure, comprising:
a first electrically conductive layer;
a first underlying layer comprising a first resin and inorganic particles;
a support comprising a second resin; and
a resin layer comprising a third resin that is at least one selected from the group consisting of a resin of same kind as the second resin and a resin having a softening temperature equal to or lower than a softening temperature of the second resin,
the first electrically conductive layer, the first underlying layer, the support, and the resin layer being disposed in this order,
wherein the first underlying layer is in direct contact with the first electrically conductive layer and the support.
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