US 11,680,917 B2
Controller for thermal analysis apparatus, and thermal analysis apparatus
Ryokuhei Yamazaki, Tokyo (JP); and Susumu Ito, Tokyo (JP)
Assigned to HITACHI HIGH-TECH SCIENCE CORPORATION, Tokyo (JP)
Filed by HITACHI HIGH-TECH SCIENCE CORPORATION, Tokyo (JP)
Filed on Feb. 4, 2021, as Appl. No. 17/167,834.
Claims priority of application No. JP2020-036513 (JP), filed on Mar. 4, 2020.
Prior Publication US 2021/0278353 A1, Sep. 9, 2021
Int. Cl. G01N 25/20 (2006.01); G01K 17/00 (2006.01); G01N 21/00 (2006.01); G01J 5/00 (2022.01)
CPC G01N 25/20 (2013.01) [G01J 5/00 (2013.01); G01K 17/00 (2013.01); G01N 21/00 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A controller for a thermal analysis apparatus, the thermal analysis apparatus being configured to measure a thermal behavior accompanying a temperature change caused by one of heating and cooling of a measurement target, the controller being configured to:
acquire an intensity of a response signal of the measurement target, which is being heated or cooled, to an electromagnetic wave with which the measurement target is irradiated with respect to a variable of one of a time and a temperature;
differentiate the intensity with respect to the variable; and
output a derivative value obtained as a result of the differentiation with respect to one of the temperature and the time, or display the derivative value with respect to one of the temperature and the time on a predetermined display as a function expressing the thermal behavior of the measurement target.