CPC C09J 163/00 (2013.01) [B62D 65/02 (2013.01); C08G 59/188 (2013.01); C08K 3/22 (2013.01); C08K 3/36 (2013.01); C09J 5/06 (2013.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); C08K 2003/2206 (2013.01); C09J 2400/16 (2013.01); C09J 2463/00 (2013.01)] | 2 Claims |
1. A low-temperature heat-curable adhesive composition for structures, comprising:
(A) an epoxy resin;
(B) a micro-encapsulated curing agent;
(C) a hygroscopic agent;
(D) a viscosity modifier; and
(E) a stabilizer,
wherein the (C) hygroscopic agent comprises surface-treated calcium oxide and non-surface-treated calcium oxide.
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