US 11,680,133 B2
Material for forming organic film, patterning process, and polymer
Daisuke Kori, Joetsu (JP); Takayoshi Nakahara, Joetsu (JP); Kenta Ishiwata, Joetsu (JP); and Yasuyuki Yamamoto, Joetsu (JP)
Assigned to SHIN-ETSU CHEMICAL CO., LTD., Tokyo (JP)
Filed by SHIN-ETSU CHEMICAL CO., LTD., Tokyo (JP)
Filed on Oct. 30, 2020, as Appl. No. 17/85,734.
Claims priority of application No. JP2019-215420 (JP), filed on Nov. 28, 2019.
Prior Publication US 2021/0163675 A1, Jun. 3, 2021
Int. Cl. G03F 7/075 (2006.01); G03F 7/09 (2006.01); G03F 7/11 (2006.01); C08G 61/02 (2006.01); G03F 1/50 (2012.01); G03F 7/004 (2006.01); G03F 7/32 (2006.01)
CPC C08G 61/02 (2013.01) [G03F 1/50 (2013.01); G03F 7/0045 (2013.01); G03F 7/0047 (2013.01); G03F 7/0752 (2013.01); G03F 7/094 (2013.01); G03F 7/11 (2013.01); G03F 7/325 (2013.01); C08G 2261/314 (2013.01); C08G 2261/334 (2013.01)] 20 Claims
 
1. A material for forming an organic film, comprising:
a polymer having a repeating unit shown by the following general formula (1); and
an organic solvent,

OG Complex Work Unit Chemistry
wherein AR1 and AR2 each represent a benzene ring or a naphthalene ring which optionally have a substituent; W1 represents a divalent organic group having 2 to 20 carbon atoms and no aromatic ring, and a methylene group constituting the organic group is optionally substituted with an oxygen atom or a carbonyl group; and W2 represents a divalent organic group having 6 to 80 carbon atoms and at least one or more aromatic rings.