CPC B24B 37/26 (2013.01) [B24B 37/005 (2013.01); B24B 37/042 (2013.01); B24B 37/24 (2013.01)] | 18 Claims |
1. A chemical mechanical planarization (CMP) tool comprising:
a platen; and
a polishing pad attached to the platen, wherein a first surface of the polishing pad facing away from the platen comprises a first polishing zone and a second polishing zone, wherein the first polishing zone is a circular region at a center of the first surface of the polishing pad, and the second polishing zone is an annular region around the first polishing zone, wherein the first polishing zone and the second polishing zone have different surface properties, wherein the first polishing zone and the second polishing zone comprise different materials and have different groove patterns.
|