| US 7,551,767 B2 | ||
| Pattern inspection apparatus | ||
| Hideo Tsuchiya, Kawasaki (Japan); Kyoji Yamashita, Yokohama (Japan); Toshiyuki Watanabe, Yokohama (Japan); Ikunao Isomura, Yokohama (Japan); Toru Tojo, Naka-gun (Japan); and Yasushi Sanada, Yokohama (Japan) | ||
| Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan) | ||
| Filed on Feb. 29, 2008, as Appl. No. 12/40,541. | ||
| Application 12/040541 is a continuation of application No. 10/642760, filed on Aug. 19, 2003, granted, now 7,421,109. | ||
| Claims priority of application No. 2002-240858 (JP), filed on Aug. 21, 2002. | ||
| Prior Publication US 2008/0166054 A1, Jul. 10, 2008 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. G06K 9/00 (2006.01) | ||
| U.S. Cl. 382—144 [382/218; 348/130; 356/394; 356/237.14] | 9 Claims |
| 1. A method of pattern inspection comprising:
forming an optical image of a pattern formed on a plate to be inspected based on designed pattern data through imaging optics;
generating detected pattern data using a detected pattern data generator after detecting the optical image;
generating first reference pattern data from the designed pattern data, using a reference pattern data generator;
comparing the detected pattern data with the first reference pattern data to detect a defect of the pattern formed on the
plate using a first comparator;
when there are a plurality of repeated pattern areas on the plate, reading an arrangement, a number, a dimension and a repeated
pitch of the plurality of repeated pattern areas from the designed pattern data to store the inspection area as a basis of
second reference pattern data using a computer;
storing in a first memory pattern data obtained by detecting an inspection area, which is one of the plurality of repeated
pattern areas, as the second reference pattern data; and
comparing the detected pattern data with the second reference pattern data to detect the defect of the pattern formed on the
plate using a second comparator.
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