US 7,551,450 B2
External memory device
Norio Sugawara, Tochigi (Japan); Takashi Ando, Tochigi (Japan); and Hiroaki Yamanaka, Tochigi (Japan)
Assigned to Sony Corporation, Tokyo (Japan)
Appl. No. 10/506,719
PCT Filed Jan. 07, 2004, PCT No. PCT/JP2004/000035
§ 371(c)(1), (2), (4) Date Sep. 07, 2004,
PCT Pub. No. WO2004/063981, PCT Pub. Date Jul. 29, 2004.
Claims priority of application No. 2003-002675 (JP), filed on Jan. 08, 2003; application No. 2003-156072 (JP), filed on May 30, 2003; and application No. 2003-400876 (JP), filed on Nov. 28, 2003.
Prior Publication US 2005/0157462 A1, Jul. 21, 2005
Int. Cl. H05K 5/00 (2006.01)
U.S. Cl. 361—752  [361/800; 361/756] 23 Claims
OG exemplary drawing
 
1. An external storage apparatus characterized by comprising:
a main body;
a memory substrate, on which at least a semiconductor memory mounted, having an external connection terminal at one end thereof;
a substrate holder having a substrate insertion through-hole therein through which said memory substrate to be inserted, for fixing said memory substrate to said main body under in such a way that said external connection terminal projects outward from an opening at one end of said substrate insertion through-hole; and
a cap to be attachable and detachable to and from said substrate holder for protecting said external connection terminal;
wherein erroneous assembly restricting means is a rib extending to a direction intersecting with other end of said memory substrate and restricts advancement of said memory substrate into said main body by contacting with other end of said memory substrate if assembly posture of said memory substrate with respect to said main body is not correct.