| US 7,551,406 B1 | ||
| Dual electrical lapping guides with common bonding pad | ||
| Mark D. Thomas, Hollister, Calif. (US); Peng Luo, Fremont, Calif. (US); Luc Ving Chung, Fremont, Calif. (US); and Lei Larry Zhang, San Jose, Calif. (US) | ||
| Assigned to Western Digital (Fremont), LLC, Fremont, Calif. (US) | ||
| Filed on Apr. 28, 2006, as Appl. No. 11/414,468. | ||
| Application 11/414468 is a continuation in part of application No. 11/172773, filed on Jul. 01, 2005. | ||
| Int. Cl. G11B 5/127 (2006.01) | ||
| U.S. Cl. 360—317 | 9 Claims |
| 1. A magnetic recording head comprising:
a write element including a write coil and a dynamic fly-height heater;
a DFH bonding pad and a shared bonding pad both electrically connected to the dynamic fly-height heater;
a first electrical lapping guide electrically connected to a first electrical lapping guide bonding pad and the shared bonding
pad; and
a second electrical lapping guide electrically connected to a second electrical lapping guide bonding pad and the shared bonding
pad.
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