| US 7,550,898 B2 | ||
| Boundary acoustic wave device and process for producing same | ||
| Michio Kadota, Kyoto (Japan); and Hajime Kando, Ritto (Japan) | ||
| Assigned to Murata Manufacturing Co., Ltd., Kyoto (Japan) | ||
| Filed on Jun. 01, 2007, as Appl. No. 11/756,955. | ||
| Application 11/756955 is a division of application No. 11/535560, filed on Sep. 27, 2006. | ||
| Application 11/535560 is a continuation of application No. PCT/JP2005/005414, filed on Mar. 24, 2005. | ||
| Claims priority of application No. 2004-095962 (JP), filed on Mar. 29, 2004. | ||
| Prior Publication US 2007/0222337 A1, Sep. 27, 2007 | ||
| Int. Cl. H02N 41/00 (2006.01) | ||
| U.S. Cl. 310—320 [310/328; 310/365] | 11 Claims |
| 1. A boundary acoustic wave device comprising:
a first medium, a second medium, a third medium, and a fourth medium laminated in that order; and
electrodes disposed at an interface between the first medium and the second medium; wherein
at least one of the acoustic velocity in the third medium and the material of the third medium is different from that of the
fourth medium.
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