| US 7,550,849 B2 | ||
| Conductive structures including titanium-tungsten base layers | ||
| J. Daniels Mis, Cary, N.C. (US); and Dean Zehnder, Hillsborough, N.C. (US) | ||
| Assigned to Unitive International Limited, Curacao (Netherlands Antilles) | ||
| Filed on Jun. 20, 2007, as Appl. No. 11/765,648. | ||
| Application 11/765648 is a division of application No. 10/879411, filed on Jun. 29, 2004, granted, now 7,244,671. | ||
| Claims priority of provisional application 60/490340, filed on Jul. 25, 2003. | ||
| Claims priority of provisional application 60/507587, filed on Oct. 01, 2003. | ||
| Prior Publication US 2007/0241460 A1, Oct. 18, 2007 | ||
| Int. Cl. H01L 23/48 (2006.01); H01L 23/52 (2006.01) | ||
| U.S. Cl. 257—750 [257/741; 257/773; 257/774; 257/E23.019] | 34 Claims |
| 1. An electronic device comprising:
a substrate;
a conductive pad on the substrate;
an insulating layer on the substrate, the insulating layer having a via hole therein exposing a portion of the conductive
pad; and
a conductive structure on the insulating layer and on the exposed portion of the conductive pad, the conductive structure
including a base layer comprising titanium-tungsten (TiW) and a conduction layer comprising at least one of aluminum and/or
copper, wherein the base layer of the conductive structure is between an entirety of the conduction layer and the insulating
layer.
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