| US 7,550,845 B2 | ||
| Ball grid array package with separated stiffener layer | ||
| Sam Ziqun Zhao, Irvine, Calif. (US); and Reza-ur Rahman Khan, Rancho Santa Margarita, Calif. (US) | ||
| Assigned to Broadcom Corporation, Irvine, Calif. (US) | ||
| Filed on Oct. 31, 2002, as Appl. No. 10/284,366. | ||
| Claims priority of provisional application 60/352877, filed on Feb. 01, 2002. | ||
| Prior Publication US 2003/0146509 A1, Aug. 07, 2003 | ||
| Int. Cl. H01L 23/48 (2006.01) | ||
| U.S. Cl. 257—738 [257/701; 257/702; 257/737; 257/669; 257/747; 257/717; 257/780; 257/E23.004; 257/E23.026; 257/E23.051] | 22 Claims |
| 1. A ball grid array (BGA) package, comprising:
a substantially planar substrate that has a plurality of contact pads on a first surface of said substrate that are electrically
connected through said substrate to a plurality of solder ball pads on a second surface of said substrate;
a substantially planar first stiffener attached to said first surface of said substrate;
a substantially planar second stiffener attached to said first surface of said substrate to be co-planar with said first stiffener,
said second stiffener being separated from said first stiffener by a channel therebetween; and
an integrated circuit (IC) die mounted to a surface of said second stiffener.
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