| US 7,550,839 B2 | ||
| Integrated circuit package and system interface | ||
| Frantisek Gasparik, Monument, Colo. (US); and Steve Callicott, Colorado Springs, Colo. (US) | ||
| Assigned to LSI Corporation, Milpitas, Calif. (US) | ||
| Filed on Sep. 15, 2008, as Appl. No. 12/283,820. | ||
| Application 12/283820 is a division of application No. 11/506680, filed on Aug. 18, 2006, granted, now 7,456,498. | ||
| Prior Publication US 2009/0020868 A1, Jan. 22, 2009 | ||
| Int. Cl. H01L 23/10 (2006.01); H01L 23/34 (2006.01) | ||
| U.S. Cl. 257—706 [257/707; 257/728; 257/E23.08; 257/E23.101] | 8 Claims |
| 1. An apparatus for enhancing the performance and extending the frequency range of integrated circuit packages, comprising:
a fissure added to a Flip-Chip (FC) package in order to improve a cross talk performance of said FC package for high and low
frequency ranges;
an AC ground connected to said fissure; and
a top wall of said fissure configured utilizing a heat spreader layer in order to form an improved IC package based on said
FC package in association with said fissure and said top wall thereof.
|