| US 7,550,305 B2 | ||
| Method of forming light-emitting element | ||
| Kenji Yamagata, Sagamihara (Japan); Takao Yonehara, Kawasaki (Japan); Yoshinobu Sekiguchi, Machida (Japan); and Kojiro Nishi, Yokohama (Japan) | ||
| Assigned to Canon Kabushiki Kaisha, Tokyo (Japan) | ||
| Filed on Oct. 18, 2007, as Appl. No. 11/874,452. | ||
| Claims priority of application No. 2006-293306 (JP), filed on Oct. 27, 2006; and application No. 2006-310305 (JP), filed on Nov. 16, 2006. | ||
| Prior Publication US 2008/0102545 A1, May 01, 2008 | ||
| Int. Cl. H01L 21/00 (2006.01); H01L 21/30 (2006.01); H01L 21/46 (2006.01) | ||
| U.S. Cl. 438—29 [438/28; 438/30; 438/93; 438/455; 438/617; 257/40; 257/72; 257/E21.122; 257/E21.57; 313/504] | 12 Claims |
| 1. A method of forming a light-emitting element by growing a separation layer and a light-emitting layer in this order on
a first substrate, bonding the light-emitting layer onto a second substrate, and removing the separation layer to form the
light-emitting layer on the second substrate, comprising:
growing a plurality of groups of the separation layers and the light-emitting layers on the first substrate, wherein the separation
layer and the light-emitting layer to be grown on the first substrate constitute one group;
patterning the light-emitting layer existing as a uppermost layer into an island shape, and then bonding the light-emitting
layer to the second substrate; and
etching the separation layer adjacent to the light-emitting layer patterned into the island shape to form the light-emitting
layer patterned into the island shape on the second substrate.
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