| US 7,550,173 B2 | ||
| Luminescent device and method of manufacturing same | ||
| Satoshi Seo, Kanagawa (Japan); and Shunpei Yamazaki, Tokyo (Japan) | ||
| Assigned to Semiconductor Energy Laboratory Co., Ltd., Atsugi-shi, Kanagawa-ken (Japan) | ||
| Filed on Mar. 02, 2005, as Appl. No. 11/69,235. | ||
| Application 11/069235 is a division of application No. 10/043786, filed on Jan. 10, 2002, abandoned. | ||
| Claims priority of application No. 2001-009544 (JP), filed on Jan. 17, 2001. | ||
| Prior Publication US 2005/0170737 A1, Aug. 04, 2005 | ||
| Int. Cl. B05D 5/06 (2006.01); B05D 3/02 (2006.01); B05D 1/02 (2006.01) | ||
| U.S. Cl. 427—66 [427/70; 427/384; 427/427.4] | 30 Claims |
| 1. A method for manufacturing a light emitting device comprising:
forming a bank;
forming a high-molecular organic compound layer comprising a solvent in which the high-molecular organic compound is dissolved
adjacent to the bank, over an electrode by an ink-jet method;
forming a low-molecular organic compound layer over the high-molecular organic compound layer comprising the solvent by vacuum
evaporation; and
heating the solvent to remove the solvent, thereby forming a mixed region comprising the high-molecular organic compound and
the low-molecular organic compound, after forming the low-molecular organic compound layer.
|