| US 7,550,097 B2 | ||
| Thermal conductive material utilizing electrically conductive nanoparticles | ||
| Sandeep Shrikant Tonapi, Niskayuna, N.Y. (US); Hong Zhong, Schenectady, N.Y. (US); Davide Louis Simone, Clifton Park, N.Y. (US); and Raymond Albert Fillion, Niskayuna, N.Y. (US) | ||
| Assigned to Momentive Performance Materials, Inc., Albany, N.Y. (US) | ||
| Filed on Sep. 03, 2003, as Appl. No. 10/654,391. | ||
| Prior Publication US 2005/0045855 A1, Mar. 03, 2005 | ||
| Int. Cl. H01B 1/22 (2006.01) | ||
| U.S. Cl. 252—512 [165/185; 106/1.18] | 26 Claims |
| 1. A thermal interface composition, comprising:
a blend of a polymer matrix, wherein the polymer matrix comprises a curable polymeric composition,
at least one micron-sized filler, and
nanoparticles that are electrically conductive relative to the micro-sized filler,
wherein the thermal interface composition is thermally conducting and electrically non-conducting.
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