| US 7,549,811 B2 | ||
| Substrate treating apparatus | ||
| Yoshihisa Yamada, Kyoto (Japan); Masafumi Maeda, Kyoto (Japan); and Takashi Taguchi, Kyoto (Japan) | ||
| Assigned to Dainippon Screen Mfg. Co., Ltd., (Japan) | ||
| Filed on Nov. 30, 2007, as Appl. No. 11/948,198. | ||
| Application 11/948198 is a division of application No. 11/008842, filed on Dec. 10, 2004, granted, now 7,323,060. | ||
| Claims priority of application No. 2003-413275 (JP), filed on Dec. 11, 2003. | ||
| Prior Publication US 2008/0092805 A1, Apr. 24, 2008 | ||
| Int. Cl. G03D 5/00 (2006.01); G03B 13/00 (2006.01); G03B 27/52 (2006.01); B05C 11/02 (2006.01); B05B 13/04 (2006.01) | ||
| U.S. Cl. 396—611 [396/571; 118/52; 118/320; 355/27; 414/935] | 1 Claim |
| 1. A substrate treating apparatus having heat-treating modules for heat-treating substrates, chemical treating modules for
chemically treating the substrates, and substrate transport mechanisms for transferring the substrates to and from a treating
unit including the heat-treating modules and the chemical treating modules, wherein:
said heat-treating modules include cooling modules for cooling the substrates, and heating modules for heating the substrates;
said cooling modules and said heating modules are thermally divided from each other;
said heating modules and said chemical treating modules form treating blocks opposed to each other across a substrate transport
path formed along the treating units; and
said cooling modules serve to transfer the substrates between said treating blocks.
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