| US 7,549,567 B2 | ||
| Component mounting tool, and method and apparatus for mounting component using this tool | ||
| Kazushi Higashi, Neyagawa (Japan); Shozo Minamitani, Ibaraki (Japan); Shinji Kanayama, Kashihara (Japan); and Kenji Takahashi, Suita (Japan) | ||
| Assigned to Panasonic Corporation, Osaka (Japan) | ||
| Filed on Jan. 30, 2007, as Appl. No. 11/668,794. | ||
| Application 11/668794 is a division of application No. 10/375953, filed on Feb. 28, 2003, granted, now 7,219,419. | ||
| Application 10/375953 is a division of application No. 09/388705, filed on Sep. 02, 1999, abandoned. | ||
| Claims priority of application No. 10-254963 (JP), filed on Sep. 09, 1998. | ||
| Prior Publication US 2007/0119905 A1, May 31, 2007 | ||
| Int. Cl. B23K 1/06 (2006.01); B23K 5/20 (2006.01) | ||
| U.S. Cl. 228—110.1 [228/1.1; 156/73.5; 156/285] | 17 Claims |
| 8. A method for mounting a component to an object, the steps of the method comprising:
picking up a component by suction with a working face of a suction nozzle having a predetermined surface roughness;
positioning the component so that its metal interconnect faces a metal interconnect in an object to which the component is
to be mounted;
pressing the component to the object;
applying ultrasonic vibration in a direction along a face of one of the object and component by the working face of the suction
nozzle to ultrasonically bond the component and the object; and
applying ultrasonic vibration to the suction nozzle while the working face is in contact with an abrasive tape and while moving
the abrasive tape, at an appropriate time in between bonding of a component to the object, to refinish the working face to
a predetermined surface roughness.
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