| US 7,549,344 B2 | ||
| Pressure sensor package and electronic part | ||
| Satoshi Yamamoto, Sakura (Japan); Mikio Hashimoto, Sakura (Japan); and Takanao Suzuki, Sakura (Japan) | ||
| Assigned to Fujikura Ltd., Tokyo (Japan) | ||
| Filed on Jul. 17, 2008, as Appl. No. 12/175,245. | ||
| Application 12/175245 is a continuation of application No. PCT/JP2007/050801, filed on Jan. 19, 2007. | ||
| Claims priority of application No. 2006-010961 (JP), filed on Jan. 19, 2006; and application No. 2006-256003 (JP), filed on Sep. 21, 2006. | ||
| Prior Publication US 2008/0276713 A1, Nov. 13, 2008 | ||
| Int. Cl. G01L 9/00 (2006.01) | ||
| U.S. Cl. 73—754 [257/678] | 18 Claims |
| 1. A pressure sensor package comprising:
a pressure sensor comprising:
a cavity disposed within a semiconductor substrate, wherein a region of the substrate above the cavity comprises a diaphragm
section;
a plurality of pressure-sensitive elements, wherein at least of portion of each pressure-sensitive element is disposed on
the diaphragm section; and
a plurality of conductive portions laterally spaced from the cavity and electrically connected to the pressure sensitive elements;
a plurality of electrically conductive bumps arranged on the conductive portions and electrically connected to the conductive
portions,
wherein a total thickness D1 of the semiconductor substrate, a thickness D2 of the diaphragm section, a thickness D3 of the cavity, and a thickness D4=D1−(D2+D3) satisfy the relationships: (D2+D3) in a range of approximately 5-20 μm, and D1 not less than about 100 μm.
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