| US 7,549,216 B2 | ||
| Method of manufacturing a thin film magnetic head | ||
| Yoshitaka Sasaki, Milpitas, Calif. (US); Takehiro Kamigama, Kwai Chung (Hong Kong Special Administrative Region of the People's Republic of China, The); and Hiroyuki Itoh, Milpitas, Calif. (US) | ||
| Assigned to Headway Technologies, Inc., Milpitas, Calif. (US); and SAE Magnetics (H.K.) Ltd., Shatin, N.T. (Hong Kong Special Administrative Region of the People's Republic of China, The) | ||
| Filed on Mar. 17, 2006, as Appl. No. 11/377,267. | ||
| Application 11/377267 is a division of application No. 10/673172, filed on Sep. 30, 2003, granted, now 7,060,207. | ||
| Prior Publication US 2006/0158781 A1, Jul. 20, 2006 | ||
| Int. Cl. G11B 5/17 (2006.01) | ||
| U.S. Cl. 29—603.24 [29/603.23; 29/603.25; 360/123.11; 360/123.39] | 11 Claims |
| 1. A method for manufacturing a thin film magnetic head comprising a write element, the method comprising the steps of:
forming a first coil, a first pole piece and a first back gap piece on a first insulating film formed on a surface of a first
magnetic film, wherein the first coil, the first pole piece and the first back gap piece have a taper angle making a sectional
shape of the first coil, the first pole piece and the first back gap piece wider in a lower part and narrower in an upper
part;
forming a second insulating film on surfaces of the first coil, the first pole piece and the first back gap piece;
forming a first seed film on said second insulating film;
growing a first plating film for a second coil on said first seed film in an area where said second coil is to be formed,
so that said first plating film fills up spaces between said first pole piece and an outermost coil turn of said first coil,
between coil turns of said first coil, and between an innermost coil turn of said first coil and said first back gap piece;
and
performing a flattening process of said first plating film by polishing, thereby obtaining a pattern of said second coil,
wherein the second coil has a taper angle making a sectional shape of the second coil wider in a lower part and narrower in
an upper part, and the flattening process forms top surfaces of the first and the second coils as an even flat surface in
a first plane.
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