| US 7,389,080 B2 | ||
| Heating apparatus, heating apparatus control method and noncontact thermal sensing device | ||
| Toshihiro Sone, Yokohama (Japan); Osamu Takagi, Chofu (Japan); Satoshi Kinouchi, Tokyo (Japan); and Yoshinori Tsueda, Fuji (Japan) | ||
| Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan); and Toshiba Tec Kabushiki Kaisha, Tokyo (Japan) | ||
| Filed on Jul. 16, 2007, as Appl. No. 11/778,269. | ||
| Application 11/778269 is a division of application No. 11/082242, filed on Mar. 17, 2005, granted, now 7,248,808. | ||
| Prior Publication US 2008/0013997 A1, Jan. 17, 2008 | ||
| Int. Cl. G03G 15/20 (2006.01) | ||
| U.S. Cl. 399—336 [399/69] | 5 Claims |
| 1. A heating apparatus control method comprising:
heating an outer periphery face of a heat roller by utilizing a plurality of inductive heating coils allocated outside of
the heat roller;
detecting a target temperature from a target temperature detecting section provided in non-contact with the heat roller;
computing an estimated ambient temperature which is estimated as an ambient temperature at the periphery of the target temperature
sensing section;
detecting an ambient temperature at the periphery of the target temperature sensing section which is outputted at an output
voltage of a predetermined rate with respect to a total output voltage value which corresponds to the estimated ambient temperature;
computing a temperature of the heat roller on the basis of the target temperature and the ambient temperature; and
controlling power supplied to the inductive heating coil on the basis of the temperature of the heat roller.
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