| US 7,388,282 B2 | ||
| Micro-electro-mechanical system (MEMS) package having hydrophobic layer | ||
| Yeong Gyu Lee, Gyeonggi-do (Korea, Republic of); and Suk Kee Hong, Seoul (Korea, Republic of) | ||
| Assigned to Samsung Electro-Mechanics Co., Ltd., Suwon-si (Korea, Republic of) | ||
| Filed on Jul. 12, 2005, as Appl. No. 11/180,979. | ||
| Claims priority of application No. 10-2004-0079930 (KR), filed on Oct. 07, 2004. | ||
| Prior Publication US 2006/0076666 A1, Apr. 13, 2006 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. H01L 32/02 (2006.01) | ||
| U.S. Cl. 257—680 [257/710; 257/E23.128] | 8 Claims |
| 1. A micro-electro-mechanical system (MEMS) package, comprising:
a base substrate, with an MEMS element provided on a surface of the base substrate;
a lid being spaced apart from the MEMS element provided on the base substrate and covering the MEMS element;
a side sealing member provided on a side surface of the base substrate and a surface of the lid, said side sealing member
of a material composition and positioned on, and spanning between, the side surface of the base substrate and on the surface
of the lid to hermetically seal the MEMS element from an external environment; and
a thin hydrophobic layer which covers part of the side sealing member exposed to the external environment, said hydrophobic
layer of a composition and applied to the side sealing member to substantially prevent moisture and other gas from passing
through the side sealing member.
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