| US 7,387,717 B2 | ||
| Method of performing electrolytic treatment on a conductive layer of a substrate | ||
| Junji Kunisawa, Kanagawa-ken (Japan); Mitsuko Odagaki, Kanagawa-ken (Japan); Natsuki Makino, Kanagawa-ken (Japan); Koji Mishima, Kanagawa-ken (Japan); Kenji Nakamura, Kanagawa-ken (Japan); Hiroaki Inoue, Tokyo (Japan); Norio Kimura, Kanagawa-ken (Japan); Tetsuo Matsuda, Gunma-ken (Japan); Hisashi Kaneko, Kanagawa-ken (Japan); Nobuo Hayasaka, Kanagawa-ken (Japan); Katsuya Okumura, Kanagawa-ken (Japan); Manabu Tsujimura, Kanagawa-ken (Japan); and Toshiyuki Morita, Kanagawa-ken (Japan) | ||
| Assigned to Ebara Corporation, Tokyo (Japan); and Kabushiki Kaisha Toshiba, Kanagawa-Ken (Japan) | ||
| Filed on Aug. 01, 2003, as Appl. No. 10/631,726. | ||
| Application 10/631726 is a division of application No. 09/742110, filed on Dec. 22, 2000, granted, now 6,632,335. | ||
| Claims priority of application No. 11-367754 (JP), filed on Dec. 24, 1999; application No. 2000-065459 (JP), filed on Mar. 09, 2000; application No. 2000-119861 (JP), filed on Apr. 20, 2000; application No. 2000-121841 (JP), filed on Apr. 21, 2000; application No. 2000-131879 (JP), filed on Apr. 28, 2000; application No. 2000-132015 (JP), filed on May 01, 2000; application No. 2000-153754 (JP), filed on May 24, 2000; application No. 2000-369201 (JP), filed on Dec. 04, 2000; and application No. 2000-369320 (JP), filed on Dec. 04, 2000. | ||
| Prior Publication US 2004/0069646 A1, Apr. 15, 2004 | ||
| Int. Cl. C25D 7/12 (2006.01) | ||
| U.S. Cl. 205—123 [205/125; 205/133; 205/136; 205/291] | 13 Claims |
| 1. A method of performing electrolytic treatment on a conductive layer of a substrate, said method comprising:
disposing a high resistance structure between an electrode and the substrate;
shielding an area of the high resistance structure to control an electrical field of the conductive layer of the substrate;
supplying an electrolytic solution between the electrode and the conductive layer of the substrate; and
applying a voltage between the electrode and the conductive layer of the substrate to perform electrolytic treatment on the
conductive layer of the substrate;
wherein said shielding comprises vertically moving a member relative to the high resistance structure to control the electrical
field of the conductive layer of the substrate.
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