US 7,549,140 B2
Method and apparatus for decomposing semiconductor device patterns into phase and chrome regions for chromeless phase lithography
Doug Van Den Broeke, Sunnyvale, Calif. (US); Jang Fung Chen, Cupertino, Calif. (US); Thomas Laidig, Point Richmond, Calif. (US); Kurt E. Wampler, Sunnyvale, Calif. (US); and Stephen Hsu, Fremont, Calif. (US)
Assigned to ASML Masktools B. V., Ah Veldhoven (Netherlands)
Filed on Jan. 18, 2005, as Appl. No. 11/35,737.
Application 11/035737 is a division of application No. 10/395903, filed on Mar. 25, 2003, granted, now 6,851,103.
Claims priority of provisional application 60/366545, filed on Mar. 25, 2002.
Prior Publication US 2005/0125765 A1, Jun. 09, 2005
Int. Cl. G06F 17/50 (2006.01); G06F 19/00 (2006.01); G21K 5/00 (2006.01); G03F 1/00 (2006.01)
U.S. Cl. 716—19  [700/120; 700/121; 430/5; 378/35] 13 Claims
OG exemplary drawing
 
1. A method of forming a mask for optically transferring a target pattern to a substrate, said method comprising the steps of:
generating a mask pattern representing said target pattern to be imaged on said substrate;
identifying open areas in said mask pattern which do not contain any features of said target pattern to be imaged on said substrate;
modifying said mask pattern to contain a plurality of sub-resolution flare reduction features in said open areas, said plurality of sub-resolution flare reduction features comprising chromeless phase-shifting structures and partially reducing the amount of light passing through said open areas in said mask pattern; and forming the mask based on said modified mask pattern.