| US 7,548,144 B2 | ||
| MEMS switch and method of fabricating the same | ||
| Che-heung Kim, Yongin-si (Korea, Republic of); Hyung-jae Shin, Seongnam-si (Korea, Republic of); Soon-cheol Kweon, Seoul (Korea, Republic of); Kyu-sik Kim, Suwon-si (Korea, Republic of); and Sang-hun Lee, Seoul (Korea, Republic of) | ||
| Assigned to Samsung Electronics Co., Ltd., Suwon-si (Korea, Republic of) | ||
| Filed on Oct. 18, 2005, as Appl. No. 11/251,804. | ||
| Claims priority of application No. 10-2004-0107857 (KR), filed on Dec. 17, 2004. | ||
| Prior Publication US 2006/0131147 A1, Jun. 22, 2006 | ||
| Int. Cl. H01H 51/22 (2006.01) | ||
| U.S. Cl. 335—78 [200/181] | 10 Claims |
| 1. A micro electro mechanical system switch comprising:
a substrate;
a plurality of signal lines formed on the substrate and comprising switching contact points;
a plurality of immovable electrodes formed among the signal lines on the substrate;
a plurality of anchors protruding from the substrate to predetermined heights;
at least two actuating beams supported by the plurality of anchors and installed on an identical plane so as to move up and
down;
a connecting unit connecting the at least two actuating beams;
a support unit provided on the substrate so as to support the connecting unit and thus support the adjacent actuating beams
to be movable in the form of a seesaw relative to each other; and
contacting plates installed on lower surfaces of the at least two actuating beams so as to contact the switching contact points.
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