| US 7,547,979 B2 | ||
| Semiconductor device and method of locating a predetermined point on the semiconductor device | ||
| Jin Kook Jung, Seongnam-si (Korea, Republic of); and Hark-Moo Kim, Yongin-si (Korea, Republic of) | ||
| Assigned to Samsung Electronics Co., Ltd., Suwon-Si (Korea, Republic of) | ||
| Filed on Apr. 12, 2004, as Appl. No. 10/822,384. | ||
| Claims priority of application No. 10-2003-0052090 (KR), filed on Jul. 28, 2003. | ||
| Prior Publication US 2005/0023648 A1, Feb. 03, 2005 | ||
| Int. Cl. H01L 23/544 (2006.01) | ||
| U.S. Cl. 257—797 [257/E23.179] | 5 Claims |
| 1. A semiconductor device comprising:
a semiconductor substrate;
dummy patterns for a chemical mechanical polishing (CMP) method formed in a uniform pattern over the semiconductor substrate;
and
marking patterns that are formed over the semiconductor substrate to correspond to predetermined groups of the dummy patterns,
wherein at least one dummy pattern is formed between two marking patterns,
wherein a number of the dummy patterns is substantially greater than a number of the marking patterns, wherein the marking
patterns are smaller than the dummy patterns.
|