| US 7,547,923 B2 | ||
| Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof | ||
| Sang Hyun Shin, Gyunggi-Do (Korea, Republic of); Seog Moon Choi, Seoul (Korea, Republic of); and Young Ki Lee, Seoul (Korea, Republic of) | ||
| Assigned to Samsung Electro-Mechanics Co., Ltd., Gyunggi-Do (Korea, Republic of) | ||
| Filed on Apr. 13, 2007, as Appl. No. 11/783,948. | ||
| Claims priority of application No. 10-2006-0036099 (KR), filed on Apr. 21, 2006. | ||
| Prior Publication US 2007/0246715 A1, Oct. 25, 2007 | ||
| Int. Cl. H01L 29/207 (2006.01) | ||
| U.S. Cl. 257—99 [257/93; 257/98] | 3 Claims |
| 1. A light emitting diode package comprising:
an Al substrate having a recess formed therein, a side portion of the recess comprising multi-stepped reflecting surfaces:
a light source comprising light emitting diodes mounted on the Al substrate and electrically connected to patterned electrodes;
anodized insulation layers coated on the substrate for insulating the patterned electrodes from the substrate;
an encapsulant covering over the light source of the substrate; and
an Al radiator formed under the light emitting diodes of the light source to enhance heat radiation capacity.
|