| US 7,547,797 B2 | ||
| Highly volatile polyether-modified silicone surfactant | ||
| Akira Yamamoto, Gunma (Japan); and Shoji Ichinohe, Gunma (Japan) | ||
| Assigned to Shin-Etsu Chemical Co., Ltd., Tokyo (Japan) | ||
| Filed on Aug. 29, 2006, as Appl. No. 11/511,351. | ||
| Claims priority of application No. 2005-248840 (JP), filed on Aug. 30, 2005. | ||
| Prior Publication US 2007/0049509 A1, Mar. 01, 2007 | ||
| Int. Cl. C07F 7/08 (2006.01) | ||
| U.S. Cl. 556—462 [556/450; 556/451; 556/453] | 3 Claims |
| 1. A method of manufacturing a highly volatile electrical/electronic component surfactant containing a polyether-modified
silicone having one polyether chain in the molecule, wherein the surface tension at 25° C. of a 0.01 mass % aqueous solution
thereof is 25 mN/m or less, and when the polyether-modified silicone is heated from room temperature to 200° C. at a rate
of 5° C. /minute to 200° C. and the temperature is maintained at 200° C. for 100 minutes, the polyether-modified silicone
completely volatilizes said method comprising a step for reacting a hydrogen dimethylpolysiloxane having one hydrosilyl group
expressed by the following structural formula (3) in the molecule with a polyether having one terminal unsaturated group expressed
by the following formula (4):
BMe2SiO(MeBSiO)nSiMe2B (3)
wherein in formula (3), any one of B is a hydrogen atom, the remaining B are methyl groups, and n is an integer from 0-2,
CaH2a-1O(C2H4O)bR (4)
and in formula (4), a is 3-4, b is an integer from 1-7 and R is a methyl group or an ethyl group.
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