| US 7,547,645 B2 | ||
| Method for coating a structure comprising semiconductor chips | ||
| Michael Bauer, Nittendorf (Germany); Ludwig Heitzer, Regensburg (Germany); Jens Pohl, Bernhardswald (Germany); Peter Strobel, Regensburg (Germany); and Christian Stuempfl, Schwandorf (Germany) | ||
| Assigned to Infineon Technologies AG, Neubiberg (Germany) | ||
| Filed on Aug. 16, 2006, as Appl. No. 11/504,782. | ||
| Claims priority of application No. 10 2005 038 956 (DE), filed on Aug. 16, 2005. | ||
| Prior Publication US 2007/0105394 A1, May 10, 2007 | ||
| Int. Cl. H01L 21/20 (2006.01) | ||
| U.S. Cl. 438—758 [438/780; 438/781; 257/E23.077] | 16 Claims |
| 1. A method for coating a structure including at least one semiconductor chip, the method comprising:
applying coating particles to a carrier;
electrostatically charging the coating particles;
electrostatically charging the structure to a polarity opposite to the coating particles;
placing the carrier and the structure in proximity to each other to produce an electrostatic force between the coating particles
and the structure such that the coating particles move from the carrier and adhere to an area of the structure to be coated
in response to the electrostatic force; and
liquefying the coating particles located on the area of the structure to be coated via heating.
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