| US 7,547,505 B2 | ||
| Methods of forming capping layers on reflective materials | ||
| Stefan Wurm, Austin, Tex. (US); and Nora V. Edwards, Austin, Tex. (US) | ||
| Assigned to Infineon Technologies AG, Munich (Germany); and Freescale Semiconductor, Inc., Austin, Tex. (US) | ||
| Filed on Jan. 20, 2005, as Appl. No. 11/38,838. | ||
| Prior Publication US 2006/0160034 A1, Jul. 20, 2006 | ||
| Int. Cl. G03F 7/00 (2006.01); G02B 5/12 (2006.01) | ||
| U.S. Cl. 430—330 [427/166; 427/294; 359/848] | 25 Claims |
| 1. A method of forming a capping layer over a multi-layer mirror element, the method comprising:
providing the multi-layer mirror element, at least a top portion of the multi-layer mirror element having internal stress;
heating at least the multi-layer mirror element, thereby reducing the internal stress of at least the top portion of the multi-layer
mirror element; and
forming the capping layer over the multi-layer mirror element.
|